首頁
關於我們
產品介紹
THE LEADER
WAFERS
Dressing
AMC G2
SANG-A FRONTEC
Mold Release Film
AM Technology
Strip Grinding Machine
Wafer Grinding Machine
Panel Grinding Machine
Choice Technology
Backside Coating Film
Liquid Compound
Underfill
DAF
IMT
Laser clean
IMT 700MV
100P
CO2 clean
IMT C3100
UPT
MMS
EHWA
Back Grinding Wheel
EMC wafer Gringing
Si wafer Grinding
Dry Polishing
Sawing Blade
Miro Blade
Dicing Blade
CAPCON
Chip to Substrate Bonder
Chip on Wafer Bonder
Chip on Panel Bonder
YAYATECH
Wafe IR Inspection
Reel IR Inspection
Strip IR Inspection
AOI Model
ATI
SUN Series Reticle Inspection
WIND Series Wafer Inspection
CYPRESS Package Inspection
IVY Series Wire Bond Inspection
HIWIN
Semiconductor Automation Total Solution
Customize EFEM
PLP EFEM
產品應用
最新消息
聯絡我們
首頁
關於我們
產品介紹
THE LEADER
WAFERS
Dressing
AMC G2
SANG-A FRONTEC
Mold Release Film
AM Technology
Strip Grinding Machine
Wafer Grinding Machine
Panel Grinding Machine
Choice Technology
Backside Coating Film
Liquid Compound
Underfill
DAF
IMT
Laser clean
IMT 700MV
100P
CO2 clean
IMT C3100
UPT
MMS
EHWA
Back Grinding Wheel
EMC wafer Gringing
Si wafer Grinding
Dry Polishing
Sawing Blade
Miro Blade
Dicing Blade
CAPCON
Chip to Substrate Bonder
Chip on Wafer Bonder
Chip on Panel Bonder
YAYATECH
Wafe IR Inspection
Reel IR Inspection
Strip IR Inspection
AOI Model
ATI
SUN Series Reticle Inspection
WIND Series Wafer Inspection
CYPRESS Package Inspection
IVY Series Wire Bond Inspection
HIWIN
Semiconductor Automation Total Solution
Customize EFEM
PLP EFEM
產品應用
最新消息
聯絡我們
首頁
關於我們
產品介紹
THE LEADER
WAFERS
Dressing
AMC G2
SANG-A FRONTEC
Mold Release Film
AM Technology
Strip Grinding Machine
Wafer Grinding Machine
Panel Grinding Machine
Choice Technology
Backside Coating Film
Liquid Compound
Underfill
DAF
IMT
Laser clean
IMT 700MV
100P
CO2 clean
IMT C3100
UPT
MMS
EHWA
Back Grinding Wheel
EMC wafer Gringing
Si wafer Grinding
Dry Polishing
Sawing Blade
Miro Blade
Dicing Blade
CAPCON
Chip to Substrate Bonder
Chip on Wafer Bonder
Chip on Panel Bonder
YAYATECH
Wafe IR Inspection
Reel IR Inspection
Strip IR Inspection
AOI Model
ATI
SUN Series Reticle Inspection
WIND Series Wafer Inspection
CYPRESS Package Inspection
IVY Series Wire Bond Inspection
HIWIN
Semiconductor Automation Total Solution
Customize EFEM
PLP EFEM
產品應用
最新消息
聯絡我們
首頁
關於我們
產品介紹
產品應用
最新消息
聯絡我們
首頁
聯絡我們
聯絡我們
Contact US
聯絡我們
請填寫表單，我們將盡快與您聯繫！若需即時回覆，亦可使用以下聯絡方式與我們聯絡。
stanley@theleader.com.tw
Mon - Fri 8:30am - 5:30pm (TW Time)
營運總部（新竹）
302新竹縣竹北市環北路三段81號
No. 81, Sec. 3, Huanbei Rd., Zhubei City, Hsinchu County 302 , Taiwan (R.O.C.)
(03) 668-3077
stanley@theleader.com.tw
海外部門
G-17-2, Bay Avenue,Lorong Bayan Indah 1,11900 Bayan Lepas Penang
joseph@first-applied.com
+604-6052066
+6019-5989680
雲林
640雲林縣斗六市武昌路91號2樓
2F., No.91, Wuchang Rd., Douliu City, Yunlin County 640 , Taiwan (R.O.C.)
sky@theleader.com.tw
高雄
811高雄市楠梓區援中路388號
No.388, Yuanzhong Rd., Nanzi Dist., Kaohsiung City 811 , Taiwan (R.O.C.)
(07) 364-5325
jay@theleader.com.tw
Cart
購物車內沒有任何商品。
