Chip Input Method :
- Wafer : 12 ” x 2 set
- Auto Chip Tray Feeder
- Auto JEDEC Tray Feeder
- Auto TR Reel Feeder
- Carrier handle size : 330 x260mm
(Single Lane)
Capability :
- Bond Accuracy: ± 5um@3σ
- Die size : 0.9×0.9 ~70x70mm
(Up Max : 100 x 100mm / Min 0.5×0.5mm)