Capcon Limited 華封科技有限公司

Capcon Limited, established in Hong Kong in 2014. Headquarter in Hong Kong, is mainly responsible for business development strategy, marketing development, brand building and investment and financing management. R&D Center in Singapore , is responsible for innovative product development and mass production. With strong market trend in semiconductor advanced packaging and high end Electronics Manufacturing Service(EMS) industry, the company satisfies its customers with innovative products such as high precision high productivity Die Bonder and Flip Chip Bonder, Chip-on-Wafer Bonder, Package-on-Package Bonder and so on to tremendously increase customer’s Total Cost Of Ownership.


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